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New semiconductor technologies

Posted by treonsverdery , 11 July 2016 · 1,780 views

semiconductor wafer via silicon

Semiconductor vias as well as wires at integrated circuits Is there an alloy where the material actually compresses or becomes more regular(less resistive) with warmth ; A possible alloy is bismuth with silver bismuth actually expands as it crystallizes, suggesting warming makes it eentsier. Silver is a better conductor than copper, so it is possible that a BiAg alloy would actually have shrinking wires while being higher conductivity than Cu. The effect is that (possibly) the dielectric near the copper wires of vias actually gets higher quality with warming. Also Ag is like 99.8 conductive while copper is 96 or 97 suggesting 1 or 3 parts per hundred of bismuth with silver to make the higher conductivity efficienter vias or wires
This one wont work: think of ribbon candy unununu unly the bases of the n or u is obviously plausible as a photolithography thing, yet it is possible that an origami like bend could link [ununununununu] shaped ntegrated circuits. The benefit is that when placed on its side the ribbon candy could have skyscraper like vertical cooling blocks of silver or aluminum right next to the chip surface for upward convection like cooling
Longer lasting voltage amperage tolerant semiconductors think of placing a honeycomb oon the back of the IC at the nonlitho side. That causes greater dimensional stiffness which could heighten focus effectiveness during lithography, a better version is to view the active IC with a thermal camera to find the [ *] warm active areas as well as the cooler areas, then customize the honeycomb to be different sizes so it looks like a warpy honeycomb with numerous different sized <= >, the thing is that this causes the chip to avoid bending slightly during active use from thermal effects. I read about two atom transistors so omitting bending could actually be beneficial. One way to test this is with an overclocked GPU, I think I read that an overclocked, warm GPU will produce a variety of odd pixels or sparkles. That could be graphed as a frequency distribution, then a warped honeycomb support version of a GPU could be graphed as a frequency distribution, then if the odd pixels have a different data trend then that suggests that at a CPU the data trend of errors could also be modified with a warped honeycomb support side, these could tolerate higher energy at a eentsier area, heightening processor capacity
Ultra level wafers make for reduced wafer IC defects I read about a kind of coherent warmth like lensable “laminar flow”at the economist, their application was thermoelectric. A completely different application is ultra dimensional stabilizing wafers before lithography. 1) cool the wafer 2) use coherent laminar flow warmth to ultraequalize temperature at the entire wafer. This makes the wafer effectively flatter, or uniformly level, with even fewer thermal distortions than just “turbulent flow” warmth as compared with “laminar flow “ warmth 3) do the lithography on the ultra level wafer. This ultralevel wafer could be supportive of two atom transistors There is a different group of ideas based around 2 electron electron flow called lissatricity, based on possibly varied voltage moving 1 electron or two electrons at silver


Is the two electron conductivity of silver beneficial at a two atom transistor, the concept is that if there are two atoms at a transistor, then moving two electrons simultaneously to one or the other, or both might have something like 4 bits on two transistors, or possibly more. It is possible that other atoms like Osmium with 8 valence electrons could have even more byte data states per atom.

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